Ultra-high thermal conductivity substrate for electronic components

Max L. Lake, Jyh-Ming Ting, Ronald L. Jacobsen, Alexandre G. Lagounov, Joseph M. Gottschlich

研究成果: Paper同行評審

1 引文 斯高帕斯(Scopus)

摘要

The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated "diamond/carbon/carbon composite," consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed.

原文English
DOIs
出版狀態Published - 1994 十二月 1
事件Aerotech'94 - Los Angeles, CA, United States
持續時間: 1994 十月 31994 十月 6

Other

OtherAerotech'94
國家United States
城市Los Angeles, CA
期間94-10-0394-10-06

All Science Journal Classification (ASJC) codes

  • Automotive Engineering
  • Safety, Risk, Reliability and Quality
  • Pollution
  • Industrial and Manufacturing Engineering

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