Ultrasonic guided wave based horizontal crack imaging in metal plate by local wavenumber analysis

C. G. Xu, B. Q. Xu, Y. Luo, G. D. Xu, F. G. Yuan

研究成果: Conference article同行評審

摘要

Ultrasonic guided waves are one of the most prominent tools for SHM in plate-like structure. However, complex propagation characteristics of guided waves as well as traditional contact ultrasonic transducers limit its application in the practical damage detection. Scanning Laser Doppler vibrometer (SLDV) technology is an effective non-contact method to obtain ultrasonic guided wavefield with ultra-high spatial resolution. Based on abundant wavefield data, wavenumber imaging algorithms are capable of not only damage location, but also assessment of damage characteristics such as size and shape. In this work, we adopt local wavenumber analysis method for horizontal crack detection in platelike structure. Instead of using SLDV in experiment, 3D finite element numerical method is adopted to obtain full ultrasonic guided wavefield data. Since the horizontal cracks result in decrease of local thickness, the wavenumber in corresponding area shows significant increase, which is used as indicators for crack imaging. The effects of different damage shapes, depths and spatial window sizes on imaging are also discussed. Numerical simulation results and imaging algorithm laid the foundation for the method applied in experiment and practice.

原文English
文章編號95430F
期刊Proceedings of SPIE - The International Society for Optical Engineering
9543
發行號January
DOIs
出版狀態Published - 2015
事件3rd International Symposium on Laser Interaction with Matter, LIMIS 2014 - Nanjing, China
持續時間: 2014 11月 22014 11月 5

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電腦科學應用
  • 應用數學
  • 電氣與電子工程

指紋

深入研究「Ultrasonic guided wave based horizontal crack imaging in metal plate by local wavenumber analysis」主題。共同形成了獨特的指紋。

引用此