Ultrasound assisted laser machining and surface cleaning

Chi Cheng Chiu, Chih Hao Chang, Yung Chun Lee

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)

摘要

This paper investigates a new approach of using ultrasound to assist material ablation efficiency in laser machining processes. Typical laser machining methods suffer a common problem that the laser-ablated material particles will fall back to the sample surface and therefore either deter subsequent laser machining process or result in material debris on sample surface. In this work we introduce high frequency mechanical vibration, or ultrasound, to the sample under laser machining. The oscillation of sample surface can eject laser-ablated particles and therefore achieve both purposes of surface cleaning and machining speed increasing. Preliminary experimental results have support the feasibility of the propose method which can effectively improve machining quality in most laser machining for a wide variety of materials.

原文English
主出版物標題2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
頁面872-875
頁數4
DOIs
出版狀態Published - 2010
事件5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 - Xiamen, China
持續時間: 2010 1月 202010 1月 23

出版系列

名字2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

Other

Other5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
國家/地區China
城市Xiamen
期間10-01-2010-01-23

All Science Journal Classification (ASJC) codes

  • 控制與系統工程
  • 電氣與電子工程

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