Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

Kuo Chung Hsu, Dung Ching Perng, Jia Bin Yeh, Yi Chun Wang

研究成果: Article同行評審

18 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds

Physics & Astronomy