Underfill viscous flow between parallel plates and solder bumps

Wen-Bin Young, Wen Lin Yang

研究成果: Article同行評審

33 引文 斯高帕斯(Scopus)

摘要

Underfill is used to improve the reliability of the flip-chip interconnect systems. A conventional underfill is filled to the gap between the chip and substrate around the solder joints by the capillary flow. A modified Hele-Shaw flow, that considered the flow resistance in both the thickness direction and the restrictions between solder bumps, was used. This model estimates the flow resistance induced by the chip and substrate as well as the solder bumps, and provides a reasonable flow front prediction as compared to the experimental observations. A method to simulate the edge effects during the underfill process was also proposed, which gave a close flow front prediction in a chip assembly with full array solders.

原文English
頁(從 - 到)695-700
頁數6
期刊IEEE Transactions on Components and Packaging Technologies
25
發行號4
DOIs
出版狀態Published - 2002 十二月 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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