Use of BN-coated copper nanowires in nanocomposites with enhanced thermal conductivity and electrical insulation

Yongcun Zhou, Feng Liu, Chia Yun Chen

研究成果: Article同行評審

42 引文 斯高帕斯(Scopus)

摘要

Copper nanowires (CuNWs), as one-dimensional nanostructures, could be highly helpful as thermal management tools because of inherent thermal conductivity, high aspect ratio, and low cost. In this study, boron nitride-coated copper nanowires (CuNWs@BN) were successfully synthesized by an amenable and rapid technique and incorporated into synthetic polyimide (PI) to increase thermal conductivity while providing electrical insulation to nanocomposites. Maximal thermal conductivity in CuNWs@BN/PI composites containing fillers loading up to 20% volume rose to 4.12 W/mK, indicating an amelioration of 23 times in comparison with that of pure PI, while volume resistivity remained greater than 4.8 × 1013 Ω cm. Such nanocomposites with high thermal conductivity and electrical insulation could constitute important tools for thermal management. [Figure not available: see fulltext.]

原文English
頁(從 - 到)46-50
頁數5
期刊Advanced Composites and Hybrid Materials
2
發行號1
DOIs
出版狀態Published - 2019 3月 15

All Science Journal Classification (ASJC) codes

  • 陶瓷和複合材料
  • 材料化學
  • 聚合物和塑料
  • 材料科學(雜項)

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