Using nano-porous Au-Ag sheets as a joint layer for low-temperature Au-Au bonding

Hayata Mimatsu, Jun Mizuno, Takashi Kasahara, Mikiko Saito, Hiroshi Nishikawa, Shuichi Shoji

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

In this research, we proposed low-temperature Au-Au bonding using nano-porous Au-Ag sheets as a joint layer. The influences of annealing temperature on the porous structure and chemical properties of the sheets were investigated. The nano-porous sheet was fabricated by dealloying a 100μm thick Au-Ag sheet in solution HNO3. The nano-porous sheets were annealed between 100°C and 250°C. The chemical composition of the sheet was analyzed by using X-ray photoelectron spectroscopy (XPS). Two substrates and nano-porous sheet were bonded under a pressure of 8 MPa for 20 min. Bonding strengths were about 0.5 MPa, 1.0 MPa, 1.8 MPa, and 4.8 MPa at annealing temperatures of 100°C, 150°C, 200°C, and 250°C, respectively. The sheet which had about 10 nm ligament formed on the surface by additional treatment of immersing in liquid nitrogen was also used as a bonding layer. This treatment was effective to increase the bonding strength.

原文English
主出版物標題2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
DOIs
出版狀態Published - 2012
事件2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012 - Kyoto, Japan
持續時間: 2012 12月 102012 12月 12

出版系列

名字2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012

Other

Other2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
國家/地區Japan
城市Kyoto
期間12-12-1012-12-12

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程

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