Using soft lithography to fabricate gold nanoparticle patterns for bottom-gate field effect transistors

Hui Ling Huang, Jem Kun Chen, Mau Phon Houng

研究成果: Article

8 引文 (Scopus)

摘要

In this study we developed an efficient method for the direct patterning of Au, through the self-assembly of gold nanoparticles (AuNPs) from colloidal solutions, onto Si substrates. We used an integrated process involving soft lithography and self-assembly to fabricate patterns of sub-micrometer AuNPs on the Si surface. By exploiting soft lithography, we obtained nanoscale patterns of self-assembled monolayers (SAMs) without the need for traditional photolithography or etching processes. After using soft lithography to pattern a SAM of (3-mercaptopropyl)trimethoxysilane on a Si surface, we immobilized AuNPs, synthesized in a two-phase system, to form the bottom layer. We then used a cross-linking agent, 1,6-hexanedithiol, to construct multiple layers of AuNP aggregates, ultimately self-assembling five-layer structures that we employed as nanoscale metal electrodes in the fabrication of organic field effect transistors (OFETs), which exhibited output characteristics, including sheet resistance, drain-source voltage, and drain-source current, similar to those of corresponding OFETs prepared using traditional processing.

原文English
頁(從 - 到)304-308
頁數5
期刊Thin Solid Films
524
DOIs
出版狀態Published - 2012 十二月 1

指紋

Gates (transistor)
Gold
Lithography
Organic field effect transistors
field effect transistors
lithography
Self assembled monolayers
gold
Nanoparticles
nanoparticles
Self assembly
self assembly
binary systems (materials)
Sheet resistance
Photolithography
photolithography
assembling
micrometers
Etching
Metals

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

引用此文

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Using soft lithography to fabricate gold nanoparticle patterns for bottom-gate field effect transistors. / Huang, Hui Ling; Chen, Jem Kun; Houng, Mau Phon.

於: Thin Solid Films, 卷 524, 01.12.2012, p. 304-308.

研究成果: Article

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