Utilizing an adaptive grey model for short-term time series forecasting: A case study of wafer-level packaging

Che Jung Chang, Der Chiang Li, Wen Li Dai, Chien Chih Chen

研究成果: Article

11 引文 斯高帕斯(Scopus)

摘要

The wafer-level packaging process is an important technology used in semiconductor manufacturing, and how to effectively control this manufacturing system is thus an important issue for packaging firms. One way to aid in this process is to use a forecasting tool. However, the number of observations collected in the early stages of this process is usually too few to use with traditional forecasting techniques, and thus inaccurate results are obtained. One potential solution to this problem is the use of grey system theory, with its feature of small dataset modeling. This study thus uses the AGM(1,1) grey model to solve the problem of forecasting in the pilot run stage of the packaging process. The experimental results show that the grey approach is an appropriate and effective forecasting tool for use with small datasets and that it can be applied to improve the wafer-level packaging process.

原文English
文章編號526806
期刊Mathematical Problems in Engineering
2013
DOIs
出版狀態Published - 2013 八月 19

    指紋

All Science Journal Classification (ASJC) codes

  • Mathematics(all)
  • Engineering(all)

引用此