Vertically integrated electronic circuits via a combination of self-assembled polyelectrolytes, ink-jet printing, and electroless metal plating processes

Tzung Fang Guo, Shun Chi Chang, Seungmoon Pyo, Yang Yang

研究成果: Article同行評審

63 引文 斯高帕斯(Scopus)

摘要

The advantages of polymers are the fabrication and patterning of ultra-large-area coatings. In this paper, an approach which combines self-assembled polyelectrolytes, ink-jet printing, and electroless metal plating technologies for the fabrication of vertically integrated electronic circuits is successfully demonstrated. Through these processes, several layers of metal integrated circuits were deposited sequentially with polymer layers sandwiched between each layer of wires. Hence, one can build vertically integrated electronic components consisting of diodes, capacitors, resistors, and inductors with a relatively simple and low-cost technology.

原文English
頁(從 - 到)8142-8147
頁數6
期刊Langmuir
18
發行號21
DOIs
出版狀態Published - 2002 10月 15

All Science Journal Classification (ASJC) codes

  • 一般材料科學
  • 凝聚態物理學
  • 表面和介面
  • 光譜
  • 電化學

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