Vibration fracture behavior of Sn-xCu lead-free solders

Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Nien Ting He

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)


The effect of Cu content on the microstructure and the vibration deformation mechanisms of a potential lead-free solder, Sn-xCu (x=0.3, 0.6, 1.3, 1.7 wt.%), are examined in this study. The results show that proeutectic Sn-rich phase decreased, while Cu6Sn5 intermetallic compounds increased with increasing the Cu content. For the specimens with high Cu content (1.3Cu and 1.7Cu), hard massive Cu6Sn5 existed mostly amongst the proeutectic Sn-rich phase dendrites, increasing the tensile strength. Under a constant vibration force and constant initial-deflection testing, the 0.6Cu specimen with a higher damping capacity was able to absorb more vibration energy and thus possessed a greater vibration fracture resistance. In addition, the lamellar-deformed structures (LDS) and Cu 6Sn5 were able to increase the crack tortuosity, which in turn increased the crack propagation resistance.

頁(從 - 到)477-480
期刊Key Engineering Materials
345-346 I
出版狀態Published - 2007 1月 1

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 材料力學
  • 機械工業


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