Visible-blind metal-semiconductor-metal photodetectors by capping an in situ low-temperature AlN layer

K. H. Lee, P. C. Chang, S. J. Chang, C. L. Yu, Y. C. Wang, S. L. Wu

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

We present the characteristics of a nitride-based UV metal-semiconductor- metal photodetector (MSM PD) with an in situ low-temperature (LT) grown AlN cap layer. From atomic-force microscopy scan images, we could clearly see that surface pits on the sample surface are almost invisible with an LT AlN cap layer but can be observed in a conventional cap layer. Compared with conventional MSM PDs, it was found that we achieved smaller dark current and larger UV-to-visible rejection ratio for the PDs with an LT AlN cap layer. With a 5 V applied bias, the UV-to-visible rejection ratio between 360 and 400 nm was 7.26× 102 for the MSM PDs with an LT AlN cap layer. The calculated noise equivalent power and normalized detectivity biased at 5 V for the MSM PDs with an LT AlN cap layer was 1.21× 10-11 W and 4.16× 1010 cm Hz0.5W-1, respectively.

原文English
頁(從 - 到)J287-J289
期刊Journal of the Electrochemical Society
155
發行號10
DOIs
出版狀態Published - 2008

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 可再生能源、永續發展與環境
  • 表面、塗料和薄膜
  • 電化學
  • 材料化學

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