TY - GEN
T1 - VLSI implementation of wireless power and data transmission circuits for micro-stimulator
AU - Lee, Shuenn Yuh
AU - Lee, Shyh Chyang
AU - Chen, Jia Jin Jason
PY - 2003/1/1
Y1 - 2003/1/1
N2 - This paper presents the realization of the radio frequency (RF) power and data transmission for implantable micro-stimulators. This implantable device includes an internal RF front-end circuit, a control circuit, and a stimulator. A 2MHz AM modulated signal including the power and data necessary for the implantable device is received, and a stable DC voltage and digital data will be extracted to stimulate the neuromuscular stimulation. The stimulator is a currentsource stimulator, which is capable to generate a wide range of stimulation waveforms and stimulation patterns for a nerve cuff electrode. In this paper, most of the integrated circuits for the implantable device have been proposed and verified by using Hspice according to the technology of TSMC 0.25 um CMOS process.
AB - This paper presents the realization of the radio frequency (RF) power and data transmission for implantable micro-stimulators. This implantable device includes an internal RF front-end circuit, a control circuit, and a stimulator. A 2MHz AM modulated signal including the power and data necessary for the implantable device is received, and a stable DC voltage and digital data will be extracted to stimulate the neuromuscular stimulation. The stimulator is a currentsource stimulator, which is capable to generate a wide range of stimulation waveforms and stimulation patterns for a nerve cuff electrode. In this paper, most of the integrated circuits for the implantable device have been proposed and verified by using Hspice according to the technology of TSMC 0.25 um CMOS process.
UR - http://www.scopus.com/inward/record.url?scp=34047182677&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34047182677&partnerID=8YFLogxK
U2 - 10.1109/VTSA.2003.1252578
DO - 10.1109/VTSA.2003.1252578
M3 - Conference contribution
AN - SCOPUS:34047182677
T3 - International Symposium on VLSI Technology, Systems, and Applications, Proceedings
SP - 164
EP - 167
BT - VLSI 2003 - 2003 20th International Symposium on VLSI Technology, Systems and Applications, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Symposium on VLSI Technology, Systems and Applications, VLSI 2003
Y2 - 6 October 2003 through 8 October 2003
ER -