Warpage simulation for encapsulated package during post-mold curing process

H. W. Huang, T. C. Chiu, Y. S. Lai

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

In this study the effects of polymerization conversion and chemical aging on the constitutive behavior and dimension change were characterized and modeled for a commercial epoxy molding compound. Numerical finite element models incorporating these physical and thermomechanical models were developed for simulating the warpage evolution of overmolded BGA packages during post-mold curing (PMC) process. The numerical results were compared to experimental Shadow Moiré analyses for validating the modeling methodology. From the analyses it was observed that, while the chemical aging of the molding compound contributed little to the total crosslinking reaction during molding and PMC, it has a significant influence on package warpage during and after the PMC process.

原文English
主出版物標題International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
出版狀態Published - 2010 十二月 1
事件2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
持續時間: 2010 十月 202010 十月 22

出版系列

名字International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
國家/地區Taiwan
城市Taipei
期間10-10-2010-10-22

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程

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