Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Tz Cheng Chiu, En Yu Yeh

研究成果: Article同行評審

19 引文 斯高帕斯(Scopus)

摘要

Fan-out packaging technology involves processing redistribution interconnects on reconstituted wafer, which takes the form of an array of silicon dies embedded in epoxy molding compound (EMC). Yields of the redistribution interconnect processes are significantly affected by the warpage of the reconstituted wafer. The warpage can be attributed to the crosslinking reaction and viscoelastic relaxation of the EMC, and to the thermal expansion mismatch between dissimilar materials during the reconstitution thermal processes. In this study, the coupled chemical-thermomechanical deformation mechanism of a commercial EMC was characterized and incorporated in a finite element model for considering the warpage evolution during the reconstitution thermal processes. Results of the analyses indicate that the warpage is strongly influenced by the volume percentage of Si in the reconstituted wafer and the viscoelastic relaxation of the EMC. On the other hand, contribution from the chemical shrinkage of the commercial EMC on warpage is insignificant. As such, evaluations based on the comprehensive chemical-thermomechanical model considering the full process history can be approximated by the estimations from a simplified viscoelastic warpage model considering only the thermal excursion.

原文English
頁(從 - 到)14-23
頁數10
期刊Microelectronics Reliability
80
DOIs
出版狀態Published - 2018 一月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 安全、風險、可靠性和品質
  • 凝聚態物理學
  • 表面、塗料和薄膜
  • 電氣與電子工程

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