Wetting behavior between solder and electroless nickel deposits

Lin Kwang-Lung; Jang Jien-Ming

doi:10.1016/0254-0584(94)90142-2

Wetting behavior between solder and electroless nickel deposits

Lin Kwang-Lung, Jang Jien-Ming

研究成果: Article › 同行評審

24 引文斯高帕斯（Scopus）

摘要

The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni₃Sn₂ and Ni₃Sn₄ between solder and the electroless nickel deposits.

原文	English
頁（從 - 到）	33-41
頁數	9
期刊	Materials Chemistry and Physics
卷	38
發行號	1
DOIs	https://doi.org/10.1016/0254-0584(94)90142-2
出版狀態	Published - 1994 6月

All Science Journal Classification (ASJC) codes

材料科學(全部)
凝聚態物理學

存取文件

10.1016/0254-0584(94)90142-2

其它文件與鏈接

Link to publication in Scopus

引用此

@article{4da01ada34584fb1a3e5e6ac16f37ba0,

title = "Wetting behavior between solder and electroless nickel deposits",

abstract = "The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni3Sn2 and Ni3Sn4 between solder and the electroless nickel deposits.",

author = "Lin Kwang-Lung and Jang Jien-Ming",

note = "Funding Information: The financial support of the presentw ork from the NationalS cienceC ouncil of theR epublicof China under NSCSl-0404-E006-110is gratefullya cknowledged.",

year = "1994",

month = jun,

doi = "10.1016/0254-0584(94)90142-2",

language = "English",

volume = "38",

pages = "33--41",

journal = "Materials Chemistry and Physics",

issn = "0254-0584",

publisher = "Elsevier BV",

number = "1",

}

TY - JOUR

T1 - Wetting behavior between solder and electroless nickel deposits

AU - Kwang-Lung, Lin

AU - Jien-Ming, Jang

N1 - Funding Information: The financial support of the presentw ork from the NationalS cienceC ouncil of theR epublicof China under NSCSl-0404-E006-110is gratefullya cknowledged.

PY - 1994/6

Y1 - 1994/6

N2 - The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni3Sn2 and Ni3Sn4 between solder and the electroless nickel deposits.

AB - The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni3Sn2 and Ni3Sn4 between solder and the electroless nickel deposits.

UR - http://www.scopus.com/inward/record.url?scp=0028443570&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0028443570&partnerID=8YFLogxK

U2 - 10.1016/0254-0584(94)90142-2

DO - 10.1016/0254-0584(94)90142-2

M3 - Article

AN - SCOPUS:0028443570

VL - 38

SP - 33

EP - 41

JO - Materials Chemistry and Physics

JF - Materials Chemistry and Physics

SN - 0254-0584

IS - 1

ER -

Wetting behavior between solder and electroless nickel deposits

摘要

All Science Journal Classification (ASJC) codes

存取文件

其它文件與鏈接

指紋

引用此