The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni3Sn2 and Ni3Sn4 between solder and the electroless nickel deposits.
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