Wetting behavior between solder and electroless nickel deposits

Lin Kwang-Lung; Jang Jien-Ming

doi:10.1016/0254-0584(94)90142-2

Wetting behavior between solder and electroless nickel deposits

Lin Kwang-Lung, Jang Jien-Ming

研究成果: Article › 同行評審

21 引文斯高帕斯（Scopus）

摘要

The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni₃Sn₂ and Ni₃Sn₄ between solder and the electroless nickel deposits.

原文	English
頁（從 - 到）	33-41
頁數	9
期刊	Materials Chemistry and Physics
卷	38
發行號	1
DOIs	https://doi.org/10.1016/0254-0584(94)90142-2
出版狀態	Published - 1994 六月

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics

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10.1016/0254-0584(94)90142-2

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引用此

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abstract = "The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni3Sn2 and Ni3Sn4 between solder and the electroless nickel deposits.",

author = "Lin Kwang-Lung and Jang Jien-Ming",

note = "Funding Information: The financial support of the presentw ork from the NationalS cienceC ouncil of theR epublicof China under NSCSl-0404-E006-110is gratefullya cknowledged. Copyright: Copyright 2015 Elsevier B.V., All rights reserved.",

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AU - Jien-Ming, Jang

N1 - Funding Information: The financial support of the presentw ork from the NationalS cienceC ouncil of theR epublicof China under NSCSl-0404-E006-110is gratefullya cknowledged. Copyright: Copyright 2015 Elsevier B.V., All rights reserved.

PY - 1994/6

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N2 - The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni3Sn2 and Ni3Sn4 between solder and the electroless nickel deposits.

AB - The present study investigated contact angles between electroless nickel deposits and 95Pb 5Sn and 63Sn 37Pb solders under vacuum. The contact angles generally decrease with respect to temperature rise and lowering in P contents of the deposit. Annealing on the electroless nickel deposits tended to enhance the wetability of the solder on the deposits. The variation in contact angle is accompanied by the formation of the intermetallic compounds Ni3Sn2 and Ni3Sn4 between solder and the electroless nickel deposits.

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