This study investigated the wetting behavior of Cu and Ag with pure Sn and several Sn-Zn solders, including Sn-9Zn (abbreviated as Sn-Zn), Sn-8.55Zn-0.5Al (abbreviated as Sn-Zn-Al), and Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga (abbreviated as Sn-Zn-Ag-Al-Ga). Results show that Sn-Zn solders exhibit better wettability with both Cu and Ag than pure Sn. The primary interfacial intermetallics in Sn-Zn are (Ag,Cu)Zn rather than (Ag,Cu)Sn. By way of alloying modification, the Sn-Zn-Ag-Al-Ga alloy exhibits the greater wetting behavior than other solders.
|頁（從 - 到）||1310-1313|
|期刊||Proceedings - Electronic Components and Technology Conference|
|出版狀態||Published - 2004 一月 1|
|事件||2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States|
持續時間: 2004 六月 1 → 2004 六月 4
All Science Journal Classification (ASJC) codes