Wetting interaction between Pb-free Sn-Zn series solders and Cu, Ag substrates

Kwang Lung Lin, Pei Chi Liu, Jenn Ming Song

研究成果: Conference article同行評審

11 引文 斯高帕斯(Scopus)

摘要

This study investigated the wetting behavior of Cu and Ag with pure Sn and several Sn-Zn solders, including Sn-9Zn (abbreviated as Sn-Zn), Sn-8.55Zn-0.5Al (abbreviated as Sn-Zn-Al), and Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga (abbreviated as Sn-Zn-Ag-Al-Ga). Results show that Sn-Zn solders exhibit better wettability with both Cu and Ag than pure Sn. The primary interfacial intermetallics in Sn-Zn are (Ag,Cu)Zn rather than (Ag,Cu)Sn. By way of alloying modification, the Sn-Zn-Ag-Al-Ga alloy exhibits the greater wetting behavior than other solders.

原文English
頁(從 - 到)1310-1313
頁數4
期刊Proceedings - Electronic Components and Technology Conference
2
出版狀態Published - 2004 一月 1
事件2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States
持續時間: 2004 六月 12004 六月 4

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 電氣與電子工程

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