Wetting interaction between Sn-Zn-Ag solders and Cu

Kwang Lung Lin, Chia Ling Shih

研究成果: Article同行評審

66 引文 斯高帕斯(Scopus)

摘要

The wetting interaction of Sn-(7.1-9)Zn-(0-3)Ag solders with Cu was investigated from 230 °C to 300 °C. The wetting time, wetting forces, and activation energy of the wetting reaction were studied. The wetting time decreases with increasing temperature and increases with Ag content. The wetting force exhibits a disproportional correlation to temperature rise, while no trend was observed with respect to Ag content. The wetting behavior was ascribed to the interaction between Cu and Zn. The AgZn3 compound was formed at the interface when the solder contains 0.3% Ag and above, while it was formed within the bulk solder at 2% Ag and above.

原文English
頁(從 - 到)95-100
頁數6
期刊Journal of Electronic Materials
32
發行號2
DOIs
出版狀態Published - 2003 一月 22

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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