Wetting interaction between Sn-Zn-Ag solders and Cu

Kwang Lung Lin, Chia Ling Shih

研究成果: Article同行評審

66 引文 斯高帕斯(Scopus)

指紋

深入研究「Wetting interaction between Sn-Zn-Ag solders and Cu」主題。共同形成了獨特的指紋。

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds