Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate

Kwang Lung Lin, Yu Chien Wang

研究成果: Article同行評審

42 引文 斯高帕斯(Scopus)

摘要

A newly developed Pb-free Sn-9(Zn-5Al) solder was investigated for its wetting behavior on metal plated Cu substrate. The Cu substrate was plated with electroless nickel (EN) or with EN/Cu multilayer plating. The wetting behavior was investigated with a wetting balance which gave rise to a wetting curve. Fluxes including L-glutamic acid and dimethylammonium chloride were applied for enhancing the wetting behavior. The solder was unable to wet the EN plated Cu substrate without the assistance of flux until temperatures of 460°C and above. The material interaction between the solder and the substrate at this high temperature was investigated with scanning electron microscope elemental analysis. The wetting temperature between solder and EN plated copper was lowered to 310°C with the application of the above fluxes. The further incorporation of a layer of Cu plating with the EN layer further lowered the wetting temperature to 250°C.

原文English
頁(從 - 到)1205-1210
頁數6
期刊Journal of Electronic Materials
27
發行號11
DOIs
出版狀態Published - 1998 十一月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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