Wetting interactions between the Ni-Cu-P deposit and In-Sn solders

Chun Jen Chen, Kwang Lung Lin

研究成果: Article同行評審

17 引文 斯高帕斯(Scopus)

摘要

The interactions during wetting between an electroless Ni-Cu-P deposit and molten In-Sn solders were investigated with the aid of scanning electron microscope (SEM), X-ray diffractometer (XRD), and Auger electron spectroscope (AES). The intermetallics In3Ni2 and In27Ni10 were formed at the interlayer for the Ni-Cu-P with 51In-49Sn and 80In-20Sn systems, in the temperature range of 250-300°C. In addition to these two intermetallic compounds Ni3Sn4 was also formed with the 20In-80Sn system. The Ni3Sn4 dissipates gradually with increasing temperature. A two-stage wetting mechanism was disclosed for the wetting of Ni-Cu-P deposit with the In-Sn solders in the temperature range of 250-325°C.

原文English
頁(從 - 到)211-215
頁數5
期刊IEEE Transactions on Components Packaging and Manufacturing Technology Part B
20
發行號3
DOIs
出版狀態Published - 1997 八月

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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