Wetting Kinetics and the Interfacial Interaction Behavior between Electroless Ni–Cu–P and Molten Solder

Chwan Ying Lee Lee, Kwang Lung Lin Lin

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

Formation of intermetallic compounds and wetting kinetics between an electroless Ni–Cu–P deposit and molten solder were investigated. The microstructure and phase of the interface were investigated with the aid of scanning electron microscopy (SEM) and X-ray diffractometry (XRD). Intermetallic compounds Ni3Sn4 and Ni3Sn2 were formed between Ni–Cu–P deposit and solder with Cu existing in the intermetallic layer. The contact angles of molten solder on a Ni–Cu–P deposit, measured with the sessile drop method, decrease with increasing temperature and time. The activation energy for wetting of molten solder on a Ni–Co–P deposit was estimated to be 193.7 kJ mol-1.

原文English
頁數1
期刊Japanese Journal of Applied Physics
33
發行號5R
DOIs
出版狀態Published - 1994 五月

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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