Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer

Chia Wei Huang, Kwang Lung Lin

研究成果: Article同行評審

40 引文 斯高帕斯(Scopus)

摘要

The wetting time, wetting force, contact angle and interfacial reaction of Sn-8.55Zn-0.45Al-XAg (mass%) and Sn-9Zn (mass%) lead-free solders on Cu and Cu/Ni-P/Au substrates have been investigated. The Ag content, X, of the solders investigated was 0-3 mass%. The results indicate that the wettability of Sn-8.55Zn-0.45Al-XAg solders decreases with increasing Ag content. The Sn-8.55Zn-0.45Al-XAg solders containing low Ag content, less than 1mass%, exhibit better wettability than the eutectic Sn-9Zn solder. Furthermore, it was also found that the wettability of Sn-Zn based solders on Cu substrate is better than that on Cu/Ni-P/Au substrate. The when used on Cu and Cu/Ni-P/Au, Sn-9Zn solder forms Cu5Zn8 and AuZn3 respectively, while the Al-containing solders form Al4.2Cu3.2Zn 0.7 and Al2(Au, Zn). Further addition of Ag gave rise to AgZn3 particles attached to the underlying intermetallic compound.

原文English
頁(從 - 到)588-594
頁數7
期刊Materials Transactions
45
發行號2
DOIs
出版狀態Published - 2004 七月 1

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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