Whisker inhibited Sn–Bi alloy coating on copper surface to increase copper bonding strength for signal loss reduction of PCB in high-frequency

Guoyun Zhou, Yepei Tao, Wei He, Shouxu Wang, Yan Hong, Chia Yun Chen, Yuanming Chen, Chong Wang, Chaoying Ma, Shan Guo, Hua Miao, Jinqun Zhou

研究成果: Article同行評審

8 引文 斯高帕斯(Scopus)

摘要

Introducing Bi in the coating of Sn on copper surfaces for chemical bonding with prepreg was proposed to inhibit the serious whisker growth of Sn in the post–application process. The desired bonding strength and low roughness of copper surfaces (Ra = 0.5 μm) coated with this Sn–Bi alloy were both obtained under characterizations of peeling strength test and roughness measurement. Scanning electron microscopy (SEM) and X–ray photoelectron spectroscopy (XPS) confirmed that the high bonding strength is related to the high content of SnO2 in as–coated Sn–Bi alloy and the plating time with 180 s gives rise to the optimized bonding strength. Agilent Vector Network Analyzer (VNA) affirmed the lower signal loss (7 dB/m@10 GHz) in comparison with that treated with conventional brown–oxidation. Accordingly, the Sn–Bi coating on copper surface is suggested to be a candidate for layer bonding in high frequency PCB.

原文English
文章編號145718
期刊Applied Surface Science
513
DOIs
出版狀態Published - 2020 5月 30

All Science Journal Classification (ASJC) codes

  • 化學 (全部)
  • 凝聚態物理學
  • 物理與天文學 (全部)
  • 表面和介面
  • 表面、塗料和薄膜

指紋

深入研究「Whisker inhibited Sn–Bi alloy coating on copper surface to increase copper bonding strength for signal loss reduction of PCB in high-frequency」主題。共同形成了獨特的指紋。

引用此