Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation

研究成果: Conference contribution

摘要

We recently developed cost effective and highly stable bond wire and more corrosion-resistant than that of conventional Ag base wire. An efficient and environmental-friendly method, featuring a non-cyanide Au plating process was made for Au-coated Ag wire. Therefore, it can serve as feasible Au or PCC wires alternatives for the next generation. ACA wire has several advantages including excellent conductivity. This new Ag wire can meet reliability standards of wire bonding. The proposed ACA wire was studied to ensure compatibility with electrical properties; characterization of IMCs. The results show that electrical properties at high temperature manifest that the ACA wire maintains superior electrical resistance. Interfacial IMC grew Ag2Al and AuAl2 from Ag-Au ball and Al pad after aging for 500h at 175 degrees C. ACA wire formed by the non-cyanide plating method has wide application prospects in IC packaging processes.

原文English
主出版物標題20th European Microelectronics and Packaging Conference and Exhibition
主出版物子標題Enabling Technologies for a Better Life and Future, EMPC 2015
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9780956808622
出版狀態Published - 2016 一月 25
事件20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015 - Friedrichshafen, Germany
持續時間: 2015 九月 142015 九月 16

出版系列

名字20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015

Other

Other20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015
國家Germany
城市Friedrichshafen
期間15-09-1415-09-16

指紋

Wire
Plating
Electric properties
Acoustic impedance
Packaging
Aging of materials
Corrosion
Costs

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

引用此文

Tseng, Y. W., Hung, F-Y., & Lui, T-S. (2016). Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation. 於 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015 [7390675] (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015). Institute of Electrical and Electronics Engineers Inc..
Tseng, Yi Wei ; Hung, Fei-Yi ; Lui, Truan-Sheng. / Wire bonding of Au-coated Ag wire : Bondwire properties, bondability and IMCs formation. 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 2016. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).
@inproceedings{4d1a9fe785c44a3db1cebc14c4899a42,
title = "Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation",
abstract = "We recently developed cost effective and highly stable bond wire and more corrosion-resistant than that of conventional Ag base wire. An efficient and environmental-friendly method, featuring a non-cyanide Au plating process was made for Au-coated Ag wire. Therefore, it can serve as feasible Au or PCC wires alternatives for the next generation. ACA wire has several advantages including excellent conductivity. This new Ag wire can meet reliability standards of wire bonding. The proposed ACA wire was studied to ensure compatibility with electrical properties; characterization of IMCs. The results show that electrical properties at high temperature manifest that the ACA wire maintains superior electrical resistance. Interfacial IMC grew Ag2Al and AuAl2 from Ag-Au ball and Al pad after aging for 500h at 175 degrees C. ACA wire formed by the non-cyanide plating method has wide application prospects in IC packaging processes.",
author = "Tseng, {Yi Wei} and Fei-Yi Hung and Truan-Sheng Lui",
year = "2016",
month = "1",
day = "25",
language = "English",
series = "20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "20th European Microelectronics and Packaging Conference and Exhibition",
address = "United States",

}

Tseng, YW, Hung, F-Y & Lui, T-S 2016, Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation. 於 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015., 7390675, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015, Institute of Electrical and Electronics Engineers Inc., 20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015, Friedrichshafen, Germany, 15-09-14.

Wire bonding of Au-coated Ag wire : Bondwire properties, bondability and IMCs formation. / Tseng, Yi Wei; Hung, Fei-Yi; Lui, Truan-Sheng.

20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 2016. 7390675 (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

研究成果: Conference contribution

TY - GEN

T1 - Wire bonding of Au-coated Ag wire

T2 - Bondwire properties, bondability and IMCs formation

AU - Tseng, Yi Wei

AU - Hung, Fei-Yi

AU - Lui, Truan-Sheng

PY - 2016/1/25

Y1 - 2016/1/25

N2 - We recently developed cost effective and highly stable bond wire and more corrosion-resistant than that of conventional Ag base wire. An efficient and environmental-friendly method, featuring a non-cyanide Au plating process was made for Au-coated Ag wire. Therefore, it can serve as feasible Au or PCC wires alternatives for the next generation. ACA wire has several advantages including excellent conductivity. This new Ag wire can meet reliability standards of wire bonding. The proposed ACA wire was studied to ensure compatibility with electrical properties; characterization of IMCs. The results show that electrical properties at high temperature manifest that the ACA wire maintains superior electrical resistance. Interfacial IMC grew Ag2Al and AuAl2 from Ag-Au ball and Al pad after aging for 500h at 175 degrees C. ACA wire formed by the non-cyanide plating method has wide application prospects in IC packaging processes.

AB - We recently developed cost effective and highly stable bond wire and more corrosion-resistant than that of conventional Ag base wire. An efficient and environmental-friendly method, featuring a non-cyanide Au plating process was made for Au-coated Ag wire. Therefore, it can serve as feasible Au or PCC wires alternatives for the next generation. ACA wire has several advantages including excellent conductivity. This new Ag wire can meet reliability standards of wire bonding. The proposed ACA wire was studied to ensure compatibility with electrical properties; characterization of IMCs. The results show that electrical properties at high temperature manifest that the ACA wire maintains superior electrical resistance. Interfacial IMC grew Ag2Al and AuAl2 from Ag-Au ball and Al pad after aging for 500h at 175 degrees C. ACA wire formed by the non-cyanide plating method has wide application prospects in IC packaging processes.

UR - http://www.scopus.com/inward/record.url?scp=84978204677&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84978204677&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84978204677

T3 - 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015

BT - 20th European Microelectronics and Packaging Conference and Exhibition

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Tseng YW, Hung F-Y, Lui T-S. Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation. 於 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc. 2016. 7390675. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).