X-on-interposer ecosystem to migrate IoT1.0 to value-added IoT2.0

IoT applications normally involve heterogeneous integration of MCU, RF, sensor chips and discrete components, with the diversity but smaller quantity. PCB prototype is the first practical and cheap proof-of-concept (from 0 to 1) assembly using available package-ICs, components for initial functions test, software development and market trials, although with lower entry-barrier without much differentiation. SiP (system-in-package) is the next rationale revision option (from 1 to 2) for not only decent structural scaling, but also for system-level PPA (performance, power, formfactor and total cost) co-optimization, especially for the value-added sensor fusion, edge IoT2.0 applications or so called AIoT transformation.Such attempt of PCB migration to SiP options is not trivial to-be LEGO-like flows or simple ROI justification, if without deeper domain knowledges and chiplet design flow insights. Traditional SOC mindsets may be not sufficient, due to lacking system-level PPA(performance, power, area) considerations and more, such as thermal, stress management, decent what-if analysis and meaningful design-technology co-optimization among various structural stacking options. Some heterogenous cases are discussed in this article about IP/chip/package strategy, and potentially are developed for decent application-driven interposer platform technology proposals.