A highly effective transient thermal simulator using matrix convolution at Electronic System Level for three-dimensional integrated circuits

論文翻譯標題: 適用於三維晶片以矩陣摺積技術為主之電子系統層級高效溫度模擬器
  • 蘇 鈺雄

學生論文: Master's Thesis

摘要

As technology shrinks and performance requirement raises power consumption creates great amount of heat Excessive heat causes function failure reliability downgrade and other side effects Chip cost increases by 20~80% if only package and assembly are considered for maintaining normal temperature under severe thermal circumstances Thermal-aware designs require thermal simulators to accurately predict temperature distribution on chip before tapeout An ideal thermal simulator builds models fast and efficiently support different architecture and package with short execution time Nevertheless faster operational frequency made traditional steady-state analysis inadequate for simulating real world circumstances This work devoted to build a highly effective transient thermal simulator using matrix convolution at Electronic System Level Proposed simulator applies thermal-aware transient power blurring algorithm save 99% of execution time against ANSYS ICEPAK with only 4% error and extend power blurring to three-dimension analysis
獎項日期2014 十二月 4
原文English
監督員Lih-Yih Chiou (Supervisor)

引用此

A highly effective transient thermal simulator using matrix convolution at Electronic System Level for three-dimensional integrated circuits
鈺雄, 蘇. (Author). 2014 十二月 4

學生論文: Master's Thesis